The advantages and characteristics of notebook computers compared with traditional desktop computers are light and thin. Due to the narrow internal space of the notebook body and the concentration of high-heat components, it puts a lot of pressure on its heat dissipation. Usually, the designer will use the combination of heat pipes and cooling air ducts. To achieve heat dissipation, how to transfer the heat generated by the components to the heat pipe is very critical. HFC provides a combination of heat-conducting silicone gaskets and phase changes, and uses phase changes for components that generate large amounts of heat, such as main chips and GPUs. The material is used as the interface material, and other components with low heat generation use thermal pads as the thermal interface material to solve the transfer of heat from the heating component to the heat pipe, so that the heat can pass through the air duct and air convection quickly and evenly, achieving The purpose of heat dissipation.
