Is the thermal conductive material used in the DJI Spark UAV a thermal pad or a thermal grease?-5G Communication-ShenZhen Revve New Material Tech Co.,Ltd.

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Is the thermal conductive material used in the DJI Spark UAV a thermal pad or a thermal grease?

Source : 5G Communication Edit : Revve New Material Read : 55 Time : 2023-04-29

With the development of science and technology and the advancement of the times, drones gradually appear in people's field of vision. It can take 360-degree shots around the target and quickly and accurately convey them to the ground staff for them to analyze, judge, and formulate solutions to reduce The labor intensity of the staff is reduced, and the efficiency and reliability of the inspection work are improved.

The drone chosen this time is DJI Xiao Spark, so what we need to know this time is which thermal material is used in the drone?

DJI Spark UAV consists of two sets of cameras, 3D sensing system, infrared altimeter module, GLONASS dual-mode satellite positioning system, high-precision inertial measurement unit and 24-core high-performance computing unit. Through the close cooperation of science and technology, it forms a powerful The FlightAutonomy system.

The powerful flight control system of DJI Spark uses the fan as the main heat sink. The structural design of the heat sink determines that the heat will not run to the positioning module next to it, which can improve the overall reliability!

DJI Spark has many auxiliary functions, so there are many chips on the board, and thermal grease is applied to the heat dissipation frame and screen cover. Take off the screen cover, there is thermal grease on almost every chip, and heat dissipation is especially important under the hot sun outside in summer!

Thermally conductive silicone grease, commonly known as thermally conductive paste, is a pasty heat dissipation product that is filled between electronic components and heat sinks. It can fully wet the contact surface, thereby forming a very low thermal resistance interface, and the heat dissipation efficiency is better than other types of heat dissipation products. Much better.

Product Features:

1. A kind of glue similar to thermal interface material, which will not dry

2. Superior electrical insulation, it will not harden even if it is exposed to high temperature for a long time

3. It is a heat conduction chemical, which can maximize the heat conduction between the semiconductor block and the heat sink

Applications:

1. Semiconductor block and radiator

2. Automatic operation and screen printing

3. High-performance processor and graphics processor

4. Between the power supply resistor and the base, between the temperature regulator and the assembly surface, thermoelectric cooling device, etc.

The front and back pictures of the cleaned motherboard are as follows:

The size of this drone is small, and the batteries of the video recording system are all concentrated together, so the heat dissipation must be done very well to support a flight of up to 16 minutes.

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Application

Smart Security 5G Communication Medical equipment 3C electronics New Energy Vehicle LED lighting