Welcome to ShenZhen Revve New Material Tech Co.,Ltd. website
微信二维码
Revve New Material
Thermal (TIM) and EMI Solutions Provider
5G IoT gateway heat dissipation design, please choose high thermal conductivity, low thermal resistance, good compressibility thermal silica gel sheet
Source : 5G Communication Edit : Revve New Material Read : 47 Time : 2023-05-06

The 5G Internet of Things gateway is one of the core components of the Internet of Things era, and it is the link between the perception network and the traditional communication network. It can realize the protocol conversion between sensory network and communication network, as well as between different types of sensory networks. It can realize both wide-area interconnection and local area interconnection. It also has device management functions and extensive access capabilities.

1683341114-1734.jpg

Compared with 4G industrial gateways, 5G industrial gateways have greatly improved overall hardware configuration and performance indicators. The application scenarios of 5G industrial gateways have greatly increased and expanded, especially suitable for scenarios with big data, wide access, high speed, and low latency. It has applications in scenarios such as Internet of Vehicles, industrial control, smart manufacturing, smart medical care, smart city, and smart energy.

In order to ensure that the IoT gateway device can still complete the integration and processing of a large amount of information and data under harsh conditions, simulation software can be used to do heat dissipation design, optimize the position of the air outlet and components, and the thermal management of the internal chip to ensure the normal operation of the device. The high-temperature area of the IoT gateway device is mainly at the CPU. A thermally conductive silicone sheet with high thermal conductivity, low thermal resistance, and good compressibility can be used to transfer the heat from the CPU to the heat sink. Its flexibility and elasticity can be used to cover very uneven surfaces. Surface, its excellent efficiency conducts heat from the heat-generating device or the entire PCB to the metal case or diffuser, thereby improving the efficiency and service life of the heat-generating electronic components.

联系客服
REVVE New Material
Thermal (TIM) and EMI Solutions Provider

Wechat

Scan code to addScan code to add
86-13829256947
复制成功
微信号: 86-13829256947
添加微信好友, 详细了解产品
添加微信
知道了